The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2025
Filed:
Sep. 15, 2024
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Joongsuk Oh, Watervliet, NY (US);
Jaemyung Choi, Niskayuna, NY (US);
Kang-Ill Seo, Springfield, VA (US);
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2005.12); H01L 21/768 (2005.12); H01L 23/00 (2005.12); H01L 23/48 (2005.12); H01L 29/417 (2005.12);
U.S. Cl.
CPC ...
H01L 23/481 (2012.12); H01L 21/76819 (2012.12); H01L 21/76885 (2012.12); H01L 21/76892 (2012.12); H01L 23/562 (2012.12); H01L 29/41725 (2012.12);
Abstract
Provided is a semiconductor device including a base layer and an interconnect structure on the base layer, the interconnect structure including: a 1metal line on the base layer; a 1top via vertically protruded from the 1metal line without a connection surface therebetween; an isolation layer on the 1metal line and the 1top via; and a planarization stop layer vertically and laterally on the isolation layer.