The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Feb. 24, 2022
Applicant:

Hitachi Energy Ltd, Zürich, CH;

Inventors:

Niko Pavlicek, Zürich, CH;

Lluis Santolaria, Olten, CH;

Dominik Truessel, Bremgarten, CH;

Helder Mata, Baden, CH;

Assignee:

Hitachi Energy Ltd, Zürich, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/46 (2005.12); H01L 21/48 (2005.12); H01L 21/56 (2005.12); H01L 23/31 (2005.12); H01L 23/473 (2005.12); H05K 7/20 (2005.12);
U.S. Cl.
CPC ...
H01L 23/473 (2012.12); H01L 21/4817 (2012.12); H01L 21/4882 (2012.12); H01L 21/565 (2012.12); H01L 23/3142 (2012.12); H05K 7/20927 (2012.12);
Abstract

A cooling assembly includes a first cooler part having an opening and an attachment point arranged on a first side of the first cooler part. The opening is configured to receive an integrated cooling structure of a corresponding semiconductor module that includes a baseplate to be attached to the attachment point on the first side of the first cooler part. A second cooler part is arranged on an opposite, second side of the first cooler part. The first cooler part and the second cooler part are made from a fiber reinforced polymer material and are joined so as to form a cavity for a coolant between the second side of the first cooler part and the second cooler part.


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