The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Jan. 19, 2023
Applicant:

Google Llc, Mountain View, CA (US);

Inventors:

Woon-Seong Kwon, Santa Clara, CA (US);

Yuan Li, Sunnyvale, CA (US);

Zhi Yang, Fresh Meadow, NY (US);

Assignee:

Google LLC, Mountain View, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2005.12); H01L 23/00 (2005.12); H05K 3/34 (2005.12); H05K 7/20 (2005.12); H01L 25/065 (2022.12);
U.S. Cl.
CPC ...
H01L 23/3732 (2012.12); H01L 23/562 (2012.12); H01L 24/32 (2012.12); H01L 24/83 (2012.12); H05K 3/3436 (2012.12); H05K 7/20254 (2012.12); H01L 25/0655 (2012.12); H01L 2223/58 (2012.12); H01L 2224/32 (2012.12); H01L 2224/32245 (2012.12); H01L 2924/15311 (2012.12); H05K 2201/10378 (2012.12); H05K 2203/041 (2012.12);
Abstract

According to an aspect of the disclosure, an example microelectronic device assembly includes a substrate, a microelectronic element electrically connected to the substrate, a stiffener element overlying the substrate, and a heat distribution device overlying the rear surface of the microelectronic element. The stiffener element may extend around the microelectronic element. The stiffener element may include a first material that has a first coefficient of thermal expansion ('CTE'). A surface of the stiffener element may face toward the heat distribution device. The heat distribution device may include a second material that has a second CTE. The first material may be different than the second material. The first CTE of the first material of the stiffener element may be greater than the second CTE of the second material of the heat distribution device.


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