The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2025
Filed:
Oct. 23, 2023
Applicant:
Raytheon Company, Waltham, MA (US);
Inventors:
James S. Wilson, Hurst, TX (US);
Alyson M. Tuttle, Plano, TX (US);
Karl L. Worthen, Dallas, TX (US);
Assignee:
RAYTHEON TECHNOLOGIES CORPORATION, Waltham, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2005.12); H01L 23/373 (2005.12); H01L 23/473 (2005.12);
U.S. Cl.
CPC ...
H01L 23/3677 (2012.12); H01L 23/367 (2012.12); H01L 23/3736 (2012.12); H01L 23/473 (2012.12); H01L 2924/00 (2012.12); H01L 2924/0002 (2012.12);
Abstract
An electronic device includes a semiconductor substrate and a heat sink arranged on a surface of the semiconductor substrate. The heat sink includes a plurality of metal filaments that each includes a first end joined to the surface, a second end, and a body over the surface such that the body is surrounded by a coolant medium to dissipate heat. The heat sink is not part of an electrical network.