The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Jun. 09, 2022
Applicant:

Semes Co., Ltd., Cheonan-si, KR;

Inventors:

Myung Seok Cha, Seoul, KR;

Sang Min Lee, Seoul, KR;

Jin Woo Jung, Cheonan-si, KR;

Do Hyeon Yoon, Cheonan-si, KR;

Assignee:

SEMES CO., LTD., Cheonan-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2005.12); C23C 16/44 (2005.12); H01L 21/02 (2005.12);
U.S. Cl.
CPC ...
H01L 21/67034 (2012.12); C23C 16/4412 (2012.12); H01L 21/02101 (2012.12); H01L 21/67253 (2012.12);
Abstract

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing an inner space; a fluid supply unit configured to supply a treating fluid to the inner space; and a fluid exhaust unit configured to exhaust the treating fluid from the inner space, and wherein the fluid exhaust unit includes: an exhaust line connected to the chamber; and a pressure adjusting member installed at the exhaust line and configured to maintain a pressure of the inner space to a set pressure, and wherein the fluid supply unit includes: a fluid supply source; and a supply line provided between the fluid supply source and the chamber, and wherein at the supply line or the exhaust line a flow rate measuring member configured to measure a flow rate per unit time of the treating fluid flowing at the inner space is installed.


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