The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2025
Filed:
Mar. 16, 2022
Applicant:
Kokusai Electric Corporation, Tokyo, JP;
Inventors:
Arito Ogawa, Toyama, JP;
Kota Kowa, Toyama, JP;
Assignee:
Kokusai Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2005.12); C23C 16/455 (2005.12); C23C 16/52 (2005.12); H01L 21/285 (2005.12);
U.S. Cl.
CPC ...
H01L 21/28568 (2012.12); C23C 16/45534 (2012.12); C23C 16/45544 (2012.12); C23C 16/52 (2012.12);
Abstract
There is provided a technique capable of forming a sufficiently flat film. According to one aspect of the technique, there is provided a substrate processing method including: forming a metal-containing multi-layer film structure on a substrate by alternately performing: (a) forming a metal-containing film on the substrate; and (b) supplying a process gas to the substrate so as to perform one or both of (b-1) forming a crystal layer separation film to a surface of the metal-containing film and (b-2) removing abnormal growth nuclei at the surface of the metal-containing film.