The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Dec. 19, 2022
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

So Jung An, Suwon-si, KR;

Yoo Jeong Lee, Suwon-si, KR;

Hyung Jong Choi, Suwon-si, KR;

Chung Yeol Lee, Suwon-si, KR;

Kwang Yeun Won, Suwon-si, KR;

Woo Kyung Sung, Suwon-si, KR;

Myung Jun Park, Suwon-si, KR;

Jong Ho Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2005.12); H01G 4/012 (2005.12); H01G 4/232 (2005.12); H01G 4/12 (2005.12);
U.S. Cl.
CPC ...
H01G 4/30 (2012.12); H01G 4/012 (2012.12); H01G 4/2325 (2012.12); H01G 4/12 (2012.12);
Abstract

A multilayer electronic component includes a body including first and second surfaces opposing each other and third and fourth surfaces connected to the first and second surfaces and opposing each other, the body including dielectric layers and internal electrodes interposed between the dielectric layers, and an external electrode disposed on the body to be connected to the internal electrodes. The external electrode includes first and second plating layers respectively covering the third and fourth surfaces, a first electrode layer covering portions of the first and second surfaces and having one side surface in contact with one side surface of the first plating layer, a second electrode layer covering the portions of the first and second surfaces and having one side surface in contact with one side surface of the second plating layer, and third and fourth plating layers respectively covering the first and second plating layers.


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