The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2025
Filed:
Dec. 04, 2022
Dongguan Luxshare Technologies Co., Ltd, Dongguan, CN;
QianBing Yan, Dongguan, CN;
Min-Sheng Kao, Taipei, TW;
ChunFu Wu, Dongguan, CN;
Yueh-Kuo Lin, Taipei, TW;
LinChun Li, Dongguan, CN;
Chung-Hsin Fu, Taipei, TW;
DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD, Dongguan, CN;
Abstract
Disclosed is an optical module, including a circuit board, a thermally conductive substrate, a structural adhesive, a silicon photonic chip, a laser assembly, and a fiber array assembly coupled to the silicon photonic chip. The thermally conductive substrate includes a first surface, a second surface, and a first bearing seat, a second bearing seat and a third bearing seat disposed on the first surface and exposed from the opening of the circuit board. The area of the second surface is smaller than that of the first surface. Part of the first surface contacts the circuit board. The thermally conductive substrate is fixed to the circuit board by the structural adhesive. The silicon photonic chip is disposed on the first bearing seat, the laser assembly is disposed on the second bearing seat, and a joint of the fiber array assembly is disposed on the third bearing seat.