The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Mar. 11, 2021
Applicant:

Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;

Inventors:

Moriyuki Shimizu, Yokkaichi, JP;

Masaharu Nakamura, Yokkaichi, JP;

Rieko Nagao, Yokkaichi, JP;

Hiroki Muramatsu, Yokkaichi, JP;

Koichi Kato, Yokkaichi, JP;

Toshinari Kobayashi, Yokkaichi, JP;

Yukitoshi Terasaka, Yokkaichi, JP;

Kyungwoo Kim, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 1/02 (2005.12); H01B 7/02 (2005.12); H01B 7/282 (2005.12); H05K 7/02 (2005.12);
U.S. Cl.
CPC ...
G01P 1/02 (2012.12); H01B 7/02 (2012.12); H01B 7/282 (2012.12); H05K 7/02 (2012.12);
Abstract

An object is to further improve the waterproofness between an end portion of a wiring member and a resin molded part. Disclosed is a sensor device including: a sensor element; a wiring member connected to the sensor element; a first resin molded part that covers the sensor element and an end portion of the wiring member; and a second resin molded part molded separately from the first resin molded part and combined with the first resin molded part into an integral piece.


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