The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Aug. 01, 2021
Applicant:

Mitsubishi Chemical Corporation, Tokyo, JP;

Inventors:

Masanori Yamazaki, Tokyo, JP;

Masaya Sugiyama, Tokyo, JP;

Naoyuki Komuro, Tokyo, JP;

Hiromu Watanabe, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2005.12); C01B 21/064 (2005.12); C08J 5/18 (2005.12); C08K 3/38 (2005.12); H01L 23/373 (2005.12);
U.S. Cl.
CPC ...
C09K 5/14 (2012.12); C01B 21/064 (2012.12); C08J 5/18 (2012.12); C08K 3/38 (2012.12); H01L 23/373 (2012.12); C01P 2004/50 (2012.12); C01P 2004/61 (2012.12); C01P 2006/11 (2012.12); C01P 2006/32 (2012.12); C08J 2363/02 (2012.12); C08K 2003/385 (2012.12); C08K 2201/001 (2012.12); C08K 2201/003 (2012.12);
Abstract

An agglomerated boron nitride powder, including a tap density of 0.6 g/ml or more and less than 0.8 g/ml and an interparticle void volume of 0.5 ml/g or more. A heat dissipation sheet, including the agglomerated boron nitride powder. An agglomerated boron nitride powder that enables a heat dissipation sheet to have improved thermal conductivity and good withstand voltage characteristics, a heat dissipation sheet containing the agglomerated boron nitride powder, and a semiconductor device including the heat dissipation sheet are provided.


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