The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2025
Filed:
Jun. 13, 2021
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Jun Yasumoto, Fukushima, JP;
Rihoko Watanabe, Osaka, JP;
Teppei Washio, Fukushima, JP;
Hiroharu Inoue, Osaka, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2005.12); C08J 5/24 (2005.12); C08J 7/04 (2019.12); C08L 79/08 (2005.12);
U.S. Cl.
CPC ...
C08L 79/08 (2012.12); C08J 5/246 (2021.04); C08J 7/0427 (2019.12); H05K 1/0353 (2012.12); C08J 2309/06 (2012.12); C08J 2333/08 (2012.12); C08J 2363/00 (2012.12); C08J 2379/08 (2012.12); C08L 2203/16 (2012.12); C08L 2205/035 (2012.12);
Abstract
A resin composition contains a curable resin. A minimum value (Min) of loss tangent (tan δ=E″/E') of a cured product of the resin composition is equal to or greater than 0.04. The loss tangent is a ratio of a loss modulus (E″) of the cured product of the resin composition to a storage modulus (E′) thereof. The loss modulus (E″), the storage modulus (E′), and the loss tangent (tan δ=E″/E′) are obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.