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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12275839 B1

PDFFull Text
Date of Patent:
Apr. 14, 2025

Filed:

Nov. 27, 2019

Reinforcing resin composition, electronic component, method for manufacturing electronic component, mounting structure, and method for manufacturing mounting structure

Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Shigeru Yamatsu, Mie, JP;

Yasuhiro Suzuki, Osaka, JP;

Hirohisa Hino, Osaka, JP;

Assignee:

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;

Attorney:

GREENBLUM & BERNSTEIN, P.L.C.

Primary Examiner:

Rabon A Sergent

Int. Cl.
CPC ...
C08L 63/04 (2005.12); C08G 59/24 (2005.12); C08G 59/50 (2005.12); C08G 59/56 (2005.12); C08G 59/62 (2005.12); C08G 59/68 (2005.12); C08L 63/00 (2005.12); H01L 21/56 (2005.12); H01L 23/00 (2005.12); H01L 23/12 (2005.12); H01L 23/29 (2005.12); H01L 23/31 (2005.12); H05K 3/28 (2005.12);
U.S. Cl.
CPC ...
C08L 63/04 (2012.12); C08G 59/245 (2012.12); C08G 59/5046 (2012.12); C08G 59/56 (2012.12); C08G 59/621 (2012.12); C08G 59/686 (2012.12); C08L 63/00 (2012.12); H01L 21/563 (2012.12); H01L 23/12 (2012.12); H01L 23/291 (2012.12); H01L 23/293 (2012.12); H01L 23/3157 (2012.12); H01L 24/05 (2012.12); H01L 24/08 (2012.12); H01L 24/11 (2012.12); H01L 24/13 (2012.12); H01L 24/16 (2012.12); H01L 24/81 (2012.12); H05K 3/28 (2012.12); C08L 2203/206 (2012.12); C08L 2205/02 (2012.12); H01L 2224/05568 (2012.12); H01L 2224/10126 (2012.12); H01L 2224/10156 (2012.12); H01L 2224/11013 (2012.12); H01L 2224/11334 (2012.12); H01L 2224/11849 (2012.12); H01L 2224/16058 (2012.12); H01L 2224/16225 (2012.12); H01L 2224/16227 (2012.12); H01L 2224/16238 (2012.12); H01L 2224/81395 (2012.12); H01L 2224/81815 (2012.12); H01L 2224/81862 (2012.12); H01L 2224/81906 (2012.12); H01L 2224/81951 (2012.12); H01L 2924/066 (2012.12); H01L 2924/0665 (2012.12); H01L 2924/18161 (2012.12);
Abstract

A reinforcing resin composition includes an epoxy resin (A), a phenolic resin (B), and a benzoxazine compound (C).

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