The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2025
Filed:
Oct. 06, 2022
Applicant:
Mitsubishi Chemical Corporation, Tokyo, JP;
Inventors:
Assignee:
Mitsubishi Chemical Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2005.12); C08G 59/28 (2005.12); C08G 59/50 (2005.12); C08J 5/24 (2005.12); C08K 5/1539 (2005.12); C08K 7/06 (2005.12); C08K 5/315 (2005.12);
U.S. Cl.
CPC ...
C08L 63/00 (2012.12); C08G 59/28 (2012.12); C08G 59/5053 (2012.12); C08J 5/243 (2021.04); C08J 5/249 (2021.04); C08K 5/1539 (2012.12); C08K 7/06 (2012.12); C08J 2363/00 (2012.12); C08K 5/3155 (2012.12);
Abstract
A sheet molding compound which is a thickened material of an epoxy resin composition, including a component (A), a component (B), and a component (C), in which the component (A) is an epoxy resin staying at a liquid state at 25° C., the component (B) is an acid anhydride, the component (C) is an epoxy resin curing agent, and in the thickened material, at least some of epoxy groups of the component (A) and at least some of carboxy groups derived from the component (B) form ester.