The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Feb. 21, 2023
Applicant:

Nippon Chemical Industrial Co., Ltd., Tokyo, JP;

Inventors:

Junya Fukazawa, Tokyo, JP;

Takuma Kato, Tokyo, JP;

Toru Hata, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C01G 31/00 (2005.12);
U.S. Cl.
CPC ...
C01G 31/006 (2012.12); C01P 2002/72 (2012.12); C01P 2004/61 (2012.12); C01P 2004/62 (2012.12); C01P 2006/12 (2012.12); C01P 2006/32 (2012.12);
Abstract

An object of the present invention is to provide a negative thermal expansion material having better negative thermal expansion characteristics. The present invention is a negative thermal expansion material, comprising a copper vanadium composite oxide dissolving Li atoms and represented by the following general formula (1):(CuM)(VP)O. In the general formula (1), M represents a metallic element with an atomic number of 11 or more other than Cu and V, 1.60≤x≤2.40, 0.00≤y≤0.40, 1.60≤a≤2.40, 0.00≤b≤0.40, 5.00≤t≤9.00, 1.60≤x+y≤2.40, and 1.60≤a+b≤2.40.


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