The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2025
Filed:
Jan. 12, 2023
Applicant:
Samsung Display Co., Ltd., Yongin-Si, KR;
Inventors:
Assignee:
Samsung Display Co., Ltd., Yongin-Si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2005.12); B32B 7/12 (2005.12); B32B 15/06 (2005.12); B32B 15/095 (2005.12); B32B 15/18 (2005.12); B32B 27/40 (2005.12); H05K 3/30 (2005.12);
U.S. Cl.
CPC ...
B32B 7/12 (2012.12); B32B 15/06 (2012.12); B32B 15/095 (2012.12); B32B 15/18 (2012.12); B32B 27/40 (2012.12); B32B 2274/00 (2012.12); B32B 2307/202 (2012.12); B32B 2307/748 (2012.12); B32B 2457/20 (2012.12); H05K 1/18 (2012.12); H05K 3/30 (2012.12); H05K 2201/09027 (2012.12); H05K 2201/10128 (2012.12); H05K 2203/304 (2012.12);
Abstract
A release film includes a first release film disposed on a printed circuit board and a connector that is connected to the printed circuit board. The first release film comprises a fixing portion having a shape extending in one direction. A second release film is disposed under the printed circuit board. The second release film includes an incision portion. The fixing portion extends into the incision portion.