The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Mar. 23, 2022
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

James A. Curran, Sunnyvale, CA (US);

James A. Yurko, Saratoga, CA (US);

Todd S. Mintz, San Jose, CA (US);

Assignee:

APPLE INC., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2005.12); B29C 45/00 (2005.12); B29K 67/00 (2005.12); B29K 71/00 (2005.12); C22C 14/00 (2005.12); C23C 22/78 (2005.12); C23C 22/83 (2005.12);
U.S. Cl.
CPC ...
B29C 45/14311 (2012.12); B29C 45/0001 (2012.12); C22C 14/00 (2012.12); C23C 22/78 (2012.12); C23C 22/83 (2012.12); B29K 2067/003 (2012.12); B29K 2071/00 (2012.12);
Abstract

A chemical treatment process has been identified as a simple and effective means of improving the bonding of injection-molded polymer to titanium surfaces. This process forms an oxide layer on a titanium surface that includes a layered double hydroxide. The layered double hydroxide both raises the bond strength and minimizes air or water leakage. The process enables the use of titanium alloys with injection molded polymer structural bonds in strong, lightweight, and water-resistant enclosures for consumer electronics.


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