The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Mar. 11, 2024
Applicants:

Guangdong Jinwan Gokin Solar Technology Co., Ltd, Guangdong, CN;

Gokin Solar Co., Ltd, Guangdong, CN;

Inventors:

Mingquan Fu, Guangdong, CN;

Bing Zhu, Guangdong, CN;

Zhiqun Xu, Guangdong, CN;

Bin Sun, Guangdong, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B28D 5/00 (2005.12); B28D 5/04 (2005.12);
U.S. Cl.
CPC ...
B28D 5/0076 (2012.12); B28D 5/045 (2012.12);
Abstract

A method for solving a bright line scratched during lifting of a large-size silicon wafer comprises the steps of tooling preparation, crystal bar bonding, lifting preparation, and lifting. By optimizing and adjusting a lifting process, using a hollow plastic board and adding line-cutting fluid during lifting, the line-cutting fluid is attached to a diamond wire saw, which reduces the surface friction of the diamond wire saw, and improves lubricity. Furthermore, by adjusting the lifting process, lifting speeds varies due to different adsorption forces at different positions, so the diamond wire saw is prevented from scratching the surface of the silicon wafer, and the problem of scratching the bright line on the surface of the silicon wafer during lifting of the large-size silicon wafer is solved.


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