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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12274026 B1

PDFFull Text
Date of Patent:
Apr. 08, 2025

Filed:

May. 19, 2022

Systems for cooler devices and cooling manifolds

Applicants:

Toyota Motor Engineering & Manufacturing North America Inc., Plano, TX (US);

The Board of Trustees of the Leland Stanford Junior University, Stanford, CA (US);

The Regents of the University of California, Merced, Merced, CA (US);

Alliance for Sustainable Energy, Llc, Golden, CO (US);

Inventors:

Sougata Hazra, Stanford, CA (US);

Chi Zhang, Palo Alto, CA (US);

Mehdi Asheghi, Oakland, CA (US);

Kenneth E. Goodson, Portola Valley, CA (US);

Ercan M. Dede, Ann Arbor, MI (US);

James Palko, Merced, CA (US);

Sreekant Narumanchi, Littleton, CO (US);

Assignees:

Toyota Motor Engineering & Manufacturing North America Inc., Plano, TX (US);

Alliance for Sustainable Energy, LLC, Golden, CO (US);

The Board of Trustees of the Leland Stanford Junior University, Stanford, CA (US);

United States Department of Energy, Washington, DC (US);

Attorney:

DINSMORE & SHOHL LLP

Primary Examiner:

Tho V Duong

Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 9/22 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20272 (2013.01); F28F 9/22 (2013.01); H05K 7/20254 (2013.01);
Abstract

Disclosed herein are apparatus for a cooler device includes a manifold constructed at least partially of silicon oxide. The manifold includes an array of inlet channels and an array of outlet channels. Each inlet channel has a first depth. The array of outlet channels are interlaced with the array of inlet channels, Each outlet channel has a second depth that is larger than the first depth. Each of the array of outlet channels has a pair of sidewalls separating each outlet channel from adjacent inlet channels of the array of inlet channels.

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Quick Actions:

Hazra, Sougata. (2025). Systems for cooler devices and cooling manifolds (U.S. Patent No. 12274026). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12274026

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