The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2025
Filed:
May. 24, 2021
Amosense Co., Ltd., Cheonan-si, KR;
Taejung Kim, Cheonan-si, KR;
Wonsan Na, Cheonan-si, KR;
Baegeun Lee, Cheonan-si, KR;
Bohyeon Han, Cheonan-si, KR;
AMOSENSE CO., LTD., Cheonan-si, KR;
Abstract
The present invention relates to a power module comprising: an upper ceramic substrate (); a PCB substrate () disposed spaced apart from the upper ceramic substrate (); a plurality of semiconductor chips (G, G, G, G) spaced apart from each other, arranged in parallel, and mounted on the lower surface of the upper ceramic substrate (); and a plurality of capacitors () mounted on the top surface of the PCB substrate () to correspond to locations between the semiconductor chips (G, G, G, G). The present invention has the advantage of forming a short current path through which the semiconductor chips and the capacitors are connected, thereby increasing a circuit stabilization effect.