The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

May. 16, 2023
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Taichi Misawa, Osaka, JP;

Keiji Tanaka, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0274 (2013.01); H05K 3/103 (2013.01); H05K 3/1258 (2013.01); H05K 2201/09981 (2013.01); H05K 2201/10045 (2013.01); H05K 2201/10121 (2013.01);
Abstract

A package for an optical module includes a substrate provided through a side wall in a first direction. The substrate includes a first wiring layer including a first signal terminal, a second signal terminal, and a first ground terminal. The package includes a second wiring layer disposed under the first wiring layer. The second wiring layer includes a first ground pattern and a first insulating layer disposed between the first wiring layer and the second wiring layer, and includes a groove extending along the first direction, the groove being filled with a metal. The groove is provided within the first ground terminal, in a plan view, and the first insulating layer is free of the groove. The first ground terminal is electrically coupled to the first ground pattern through the metal of the groove.


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