The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Dec. 29, 2021
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Cheng Tan, Denver, CO (US);

Bruce Charles Fischer, Jr., Lafayette, CO (US);

Brian French, Boulder, CO (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03F 1/02 (2006.01); H03F 3/19 (2006.01); H04B 1/40 (2015.01);
U.S. Cl.
CPC ...
H03F 1/0233 (2013.01); H03F 3/19 (2013.01); H03F 2200/105 (2013.01); H03F 2200/451 (2013.01); H04B 1/40 (2013.01);
Abstract

An envelope detection circuit and methods for detecting an envelope of a signal using such an envelope detection circuit. One example envelope detection circuit generally includes a first diode, a capacitive element, and a clamping circuit. The first diode has an anode coupled to an input node of the envelope detection circuit and has a cathode coupled to an output node of the envelope detection circuit. The capacitive element is coupled in shunt between the output node and a reference potential node, and the clamping circuit is coupled in shunt between the input node and the reference potential node. The clamping circuit generally includes a resistive element coupled in series with a second diode.


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