The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Dec. 20, 2021
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Hirofumi Inoue, Tokyo, JP;

Kosuke Inoue, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 3/00 (2006.01); H02M 3/335 (2006.01); H05K 7/14 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H02M 3/003 (2021.05); H02M 3/33569 (2013.01); H02M 3/33573 (2021.05); H05K 7/14329 (2022.08); H05K 7/209 (2013.01);
Abstract

Provided is a step-down converter including: a step-down transformer including a primary-side coil and a secondary-side coil; a resin molded body integrally molded through use of a non-conductive resin together with the primary-side coil and the secondary-side coil; and a rectifier element, wherein the resin molded body has a mounting surface on which the rectifier element is to be mounted, wherein the secondary-side coil includes a first plate-shaped terminal, wherein the first plate-shaped terminal is exposed from the resin molded body in the mounting surface, wherein, on the mounting surface, a second plate-shaped terminal is provided in parallel to the first plate-shaped terminal across a gap, wherein the rectifier element is bonded to both of the first plate-shaped terminal and the second plate-shaped terminal by soldering, and wherein the non-conductive resin has a melting point higher than a melting point of the solder.


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