The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Sep. 06, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jiho Kim, Suwon-si, KR;

Seongyong An, Suwon-si, KR;

Sehyun Park, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 1/24 (2006.01); H01Q 5/25 (2015.01); H04M 1/02 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); H01Q 1/24 (2013.01); H01Q 5/25 (2015.01); H04M 1/0268 (2013.01); H04M 1/0277 (2013.01); H05K 1/14 (2013.01);
Abstract

A printed board assembly (PBA) is provided. The PBA includes first printed circuit board (PCB), a second PCB disposed parallel to the first PCB and including a conductive area, a first interposer surrounding a space between the first PCB and the second PCB, and a wireless communication circuit, wherein the interposer may include a first partition wall structure configured to provide shielding for at least one electronic component disposed in the PBA, and a second partition wall structure connected to the first partition wall structure and including an dielectric material, the second partition wall structure including a conductive via configured to connect the first PCB and the second PCB, and the wireless communication circuit may transmit and/or receive a signal in a specified frequency band by feeding power to the conductive area of the second PCB through the conductive via.


Find Patent Forward Citations

Loading…