The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Dec. 09, 2021
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventor:

Joseph Andrew Yedinak, Mountain Top, PA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 21/225 (2006.01); H01L 29/167 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7813 (2013.01); H01L 29/66734 (2013.01); H01L 29/7805 (2013.01); H01L 21/2253 (2013.01); H01L 29/167 (2013.01); H01L 29/407 (2013.01);
Abstract

In an aspect, an electronic device can include a substrate, a semiconductor layer overlying the substrate and including a mesa adjacent to a trench, and a doped region within the semiconductor layer. The doped region extends across an entire width of the mesa and contacts the lowermost point of the trench. A charge pocket can be located between an elevation of the peak concentration of the doped region and an elevation of the upper surface of the substrate. In another aspect, a process includes patterning a semiconductor layer to define a trench, forming a sacrificial layer within the trench, removing the sacrificial layer from a bottom of the trench, doping a portion of the semiconductor layer that is along the bottom of the trench while a remaining portion of the sacrificial layer is along a sidewall of the trench.


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