The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Feb. 24, 2022
Applicant:

Asahi Kasei Microdevices Corporation, Tokyo, JP;

Inventors:

Daiki Yasuda, Tokyo, JP;

Takaaki Furuya, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); G01N 33/00 (2006.01); H01L 23/00 (2006.01); H01L 27/144 (2006.01);
U.S. Cl.
CPC ...
H01L 27/156 (2013.01); G01N 33/0027 (2013.01); H01L 24/05 (2013.01); H01L 27/1446 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05019 (2013.01); H01L 2224/05558 (2013.01); H01L 2924/10332 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12043 (2013.01);
Abstract

Provided is an optical element, in which: an internal wiring portion electrically connects a first contact electrode portion and a second contact electrode portion to each other; a second region, an active layer and a second conductive semiconductor layer form a mesa structure; a pad electrode is placed so as to cover a plurality of unit elements, and is electrically connected to at least one of the first contact electrode portion and the second contact electrode portion; a first insulating portion is placed between the pad electrode and a first region of a side surface of a mesa structure and a first conductive semiconductor layer; and a diameter of a circle circumscribed to a region where the pad electrode and a connection portion are in contact with each other is 15% or more of a length of a short side of a substrate.


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