The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Mar. 04, 2021
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Kazuhiro Saito, Tokyo, JP;

Satoshi Kato, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14634 (2013.01); H01L 24/08 (2013.01); H01L 27/14636 (2013.01); H01L 2224/08145 (2013.01);
Abstract

The semiconductor device includes a first semiconductor component including a first circuit section and an interconnection connected to the first circuit section, and a second semiconductor component including a second circuit section and a third circuit section and stacked on the first semiconductor component. The interconnection is electrically connected to a first connecting portion and a second connecting portion of a plurality of connecting portions for electrically connecting the first semiconductor component and the second semiconductor component. The second circuit section is electrically connected to the interconnection via the first connecting portion. The third circuit section is electrically connected to the interconnection via the second connecting portion.


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