The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Jan. 24, 2022
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Arthur Unrau, Geseke, DE;

Szabolcs Barna, Budapest, HU;

Tobias Buehner, Warstein, DE;

Norbert Kanvasi, Cegléd, HU;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 3/08 (2006.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B23K 1/0016 (2013.01); B23K 3/085 (2013.01); B23K 2101/40 (2018.08); H01L 2224/75251 (2013.01); H01L 2224/755 (2013.01);
Abstract

An arrangement includes a chamber, a heating element arranged in the chamber, wherein the heating element, when a first connection partner with a pre-connection layer formed thereon is arranged in the chamber, is configured to heat the first connection partner and the pre-connection layer, thereby melting the pre-connection layer, and a cooling trap. During the process of heating the first connection partner with the pre-connection layer formed thereon, the cooling trap has a temperature that is lower than the temperature of all other components of or in the chamber such that liquid evaporating from the pre-connection layer is attracted by and condenses on the cooling trap.


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