The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2025
Filed:
May. 24, 2022
Applicant:
Nanya Technology Corporation, New Taipei, TW;
Inventor:
Shing-Yih Shih, New Taipei, TW;
Assignee:
NANYA TECHNOLOGY CORPORATION, New Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 23/562 (2013.01);
Abstract
The present application provides a semiconductor structure having an elastic member within a via. The semiconductor structure includes a wafer including a substrate, a dielectric layer under the substrate, and a conductive pad surrounded by the dielectric layer; a passivation layer disposed over the substrate; a conductive via extending from the conductive pad through the substrate and the passivation layer and partially through the dielectric layer; and an elastic member disposed within the conductive via.