The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2025
Filed:
Apr. 15, 2022
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Seungwon Im, Seoul, KR;
Oseob Jeon, Seoul, KR;
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);
Abstract
In a general aspect, a semiconductor device assembly includes a direct-bonded-metal (DBM) substrate having a ceramic layer, and a first metal layer having a uniform thickness that is disposed on a first surface of the DBM substrate. The assembly further includes a second metal layer disposed on a second surface of the DBM substrate opposite the first surface. The second metal layer includes a first portion having a first thickness, and a second portion having a second thickness, the second thickness being greater than the first thickness. The second portion of the second metal layer includes a metal alloy having a coefficient of thermal expansion (CTE) in a range of 7 to 11 parts-per-million per degrees Celsius (ppm/° C.). The assembly also includes a semiconductor die having a first surface coupled with the second portion of the second metal layer.