The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Mar. 03, 2021
Applicant:

Hamamatsu Photonics K.k., Hamamatsu, JP;

Inventors:

Takeshi Sakamoto, Hamamatsu, JP;

Takafumi Ogiwara, Hamamatsu, JP;

Iku Sano, Hamamatsu, JP;

Assignee:

HAMAMATSU PHOTONICS K.K., Hamamatsu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B23K 26/03 (2006.01); B23K 26/53 (2014.01); B23K 103/00 (2006.01); G01N 21/95 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67253 (2013.01); B23K 26/032 (2013.01); B23K 26/53 (2015.10); G01N 21/9501 (2013.01); H01L 21/67092 (2013.01); B23K 2103/56 (2018.08);
Abstract

An inspection device includes a laser irradiation unit irradiating a wafer with laser light, a display displaying information, and a control unit. The control unit is constituted to execute deriving of an estimated processing result including information a modified region and a crack extending from the modified region formed on the wafer when the wafer is irradiated with the laser light by the laser irradiation unit on the basis of set recipes (processing conditions), and controlling the display so as to display an estimated processing result image depicting both a graphic image of the wafer and a graphic image of the modified region and the crack in the wafer in consideration of positions of the modified region and the crack in the wafer derived as the estimated processing result.


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