The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12272540 B1

Date of Patent:

Apr. 08, 2025

Filed:

Sep. 20, 2023

Method for manufacturing a substrate

Applicant:

Soitec, Bernin, FR;

Inventors:

Pascal Guenard, Froges, FR;

Marcel Broekaart, Theys, FR;

Thierry Barge, Bernin, FR;

Assignee:

SOITEC, Bernin, FR;

Attorney:

TraskBritt

Primary Examiner:

Ermias T Woldegeorgis

Int. Cl.

CPC ...

H01L 21/02 (2006.01); H10N 30/072 (2023.01); H10N 30/50 (2023.01); H10N 30/853 (2023.01); H03H 9/02 (2006.01);

U.S. Cl.

CPC ...

H01L 21/02002 (2013.01); H01L 21/02367 (2013.01); H01L 21/02436 (2013.01); H10N 30/072 (2023.02); H10N 30/50 (2023.02); H10N 30/8542 (2023.02); H03H 9/02574 (2013.01);

Abstract

A method for manufacturing a substrate includes the following steps: (a) providing a support substrate with a first coefficient of thermal expansion, having on one of its faces a first plurality of trenches parallel to each other in a first direction, and a second plurality of trenches parallel to each other in a second direction; (b) transferring a useful layer from a donor substrate to the support substrate, the useful layer having a second coefficient of thermal expansion; wherein an intermediate layer is inserted between the front face of the support substrate and the useful layer, the intermediate layer having a coefficient of thermal expansion between the first and second coefficients of thermal expansion.

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