The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2025
Filed:
Apr. 28, 2022
Applicant:
Cyntec Co., Ltd., Hsinchu, TW;
Inventor:
Yi-Cheng Lin, Hsinchu, TW;
Assignee:
CYNTEC CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01F 27/02 (2006.01); H01F 27/245 (2006.01); H01F 27/255 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 27/30 (2006.01); H01F 27/32 (2006.01); H01F 41/02 (2006.01); H01F 41/04 (2006.01); H01F 41/12 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H01F 27/255 (2013.01); H01F 27/022 (2013.01); H01F 27/245 (2013.01); H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 27/306 (2013.01); H01F 27/323 (2013.01); H01F 41/0233 (2013.01); H01F 41/04 (2013.01); H01F 41/041 (2013.01); H01F 41/122 (2013.01); H05K 1/18 (2013.01); H05K 3/284 (2013.01); H01F 2027/2809 (2013.01); H05K 2201/10037 (2013.01);
Abstract
An electronic module comprising electrical components on a circuit board and a molding body disposed on the circuit board to encapsulate the electrical components, wherein a recess is formed in the molding body for exposing an electrode of the electronic module for connecting with an external component.