The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Jun. 01, 2021
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Kenji Tanaka, Nagaokakyo, JP;

Naoyuki Murakami, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 17/00 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 27/2804 (2013.01); H01F 27/292 (2013.01); H01F 2017/0073 (2013.01); H01F 2017/0093 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A common mode choke coil includes an element body of laminated insulating layers; electrically insulated first and second coils in the element body; first and second outer electrodes on the element body electrically connected to ends of the first coil; and third and fourth outer electrodes on the element body electrically connected to ends of the second coil. The first coil includes first to third coil conductors on first to third insulating layers. The second coil includes fourth to sixth coil conductor on fourth to sixth insulating layers. The second and third coil conductors are electrically connected via a via conductor overlapping at outer ends of the conductors. A dummy conductor overlapping the via conductor is provided on at least one of the first, fourth, fifth, and sixth insulating layers other than between the second and third insulating layers and electrically insulated from all the coil conductors.


Find Patent Forward Citations

Loading…