The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2025
Filed:
Jul. 13, 2023
Applicant:
Sandisk Technologies Llc, Addison, TX (US);
Inventors:
Toru Miwa, Yokohama, JP;
Takashi Murai, Yokohama, JP;
Hiroyuki Ogawa, Nagoya, JP;
Nisha Padattil Kuliyampattil, Bangalore, IN;
Assignee:
Sandisk Technologies, Inc., Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 1/073 (2006.01); H01L 21/66 (2006.01); H01L 23/522 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2884 (2013.01); G01R 1/07342 (2013.01); H01L 22/34 (2013.01); H01L 23/5228 (2013.01); H01L 25/0657 (2013.01); H01L 24/48 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48225 (2013.01); H01L 2225/06562 (2013.01);
Abstract
A semiconductor wafer includes pairs of semiconductor dies having test pads which are electrically coupled to each other to enable testing of pairs of semiconductor dies together at the same time. In this way, even wafers having large numbers of semiconductor dies can be tested with a semiconductor test assembly in a single touch-down test process.