The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Oct. 04, 2021
Applicant:

Soitec, Bernin, FR;

Inventor:

Eric Guiot, Bernin, FR;

Assignee:

Soitec, Bernin, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/02 (2006.01); C30B 25/20 (2006.01); C30B 29/40 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
C30B 29/406 (2013.01); C30B 25/205 (2013.01); H01L 21/76254 (2013.01);
Abstract

A method for producing a substrate for the epitaxial growth of a gallium-based III-N alloy layer comprises the following successive steps: —providing a donor substrate of single-crystal silicon carbide; —implanting ions in the donor substrate to form an embrittlement zone defining a thin film layer of single-crystal SiC; —bonding the donor substrate onto a first receiving substrate via a bonding layer; —detaching the donor substrate along the embrittlement zone to transfer the thin film of SiC onto the first receiving substrate; —epitaxially growing a layer of semi-insulating SiC having a thickness greater than 1 μm on the thin film of SiC; —bonding the layer of semi-insulating SiC onto a second receiving substrate having a high electrical resistivity; —removing at least a portion of the bonding layer to detach the first receiving substrate; and —removing the transferred thin film of single-crystal SiC, to expose the semi-insulating SiC layer.


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