The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Dec. 02, 2020
Applicants:

Hyundai Motor Company, Seoul, KR;

Kia Motors Corporation, Seoul, KR;

Shinsung Industrial Co., Ltd., Chungcheongbuk-do, KR;

Inventors:

Sung Chul Shin, Incheon, KR;

Jong Sub Lim, Chungcheongbuk-do, KR;

Assignees:

Hyundai Motor Company, Seoul, KR;

Kia Corporation, Seoul, KR;

Shinsung Industrial Co., Ltd., Chungcheongbuk-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/20 (2018.01); B32B 15/02 (2006.01); B32B 37/00 (2006.01); B32B 38/00 (2006.01); C08K 3/013 (2018.01); C08K 3/04 (2006.01); C08K 3/36 (2006.01); C08K 5/00 (2006.01); C08K 5/21 (2006.01); C08K 5/315 (2006.01); C08L 75/04 (2006.01); C09J 7/21 (2018.01); C09J 163/00 (2006.01); C08K 3/22 (2006.01); C08K 3/26 (2006.01); C08K 3/30 (2006.01); C08K 3/32 (2006.01);
U.S. Cl.
CPC ...
C09J 7/20 (2018.01); B32B 15/02 (2013.01); B32B 37/00 (2013.01); B32B 38/0004 (2013.01); C08K 3/013 (2018.01); C08K 3/04 (2013.01); C08K 3/36 (2013.01); C08K 5/0016 (2013.01); C08K 5/0025 (2013.01); C08K 5/21 (2013.01); C08K 5/3155 (2013.01); C08L 75/04 (2013.01); C09J 7/21 (2018.01); C09J 163/00 (2013.01); C08K 2003/2206 (2013.01); C08K 2003/265 (2013.01); C08K 2003/3045 (2013.01); C08K 2003/321 (2013.01); C09J 2301/122 (2020.08); C09J 2301/124 (2020.08); C09J 2301/312 (2020.08); C09J 2301/408 (2020.08); C09J 2400/143 (2013.01); C09J 2400/263 (2013.01); C09J 2421/00 (2013.01); C09J 2463/00 (2013.01); C09J 2467/006 (2013.01); C09J 2475/00 (2013.01);
Abstract

Disclosed are a structural adhesive tape in which a mesh layer is located on one side or both sides of an adhesive layer, and a method of manufacturing the same. The mesh layer having a specific specification may be used and an adhesive layer including an epoxy resin with a solid phase and a liquid phase and a flame retardant plasticizer may be used introduced so that a tape sagging phenomenon can be solved while minimizing degradation in adhesive strength. In addition, the mesh layer may be used so that a usage temperature range may be extended from a range ranging from about 5° C. to about 35° C. to a range ranging from about 0° C. to about 40° C., and thus workability in high and low temperature ranges may be improved such that tape workability can be improved even in overseas factories with poor temperature conditions.


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Shin, Sung. (2025). Structural adhesive tape and method of manufacturing the same (U.S. Patent No. 12269974). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12269974

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