The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2025
Filed:
Oct. 09, 2019
Evonik Operations Gmbh, Essen, DE;
Franz-Erich Baumann, Duelmen, DE;
Kathrin Salwiczek, Recklinghausen, DE;
Alexander Richter, Haltern am See, DE;
Evonik Operations GmbH, Essen, DE;
Abstract
A molding compound contains polyether block amide (PEBA) based on a subunit 1 made of at least one linear aliphatic diamine having 5 to 15 C atoms and at least one linear aliphatic or aromatic dicarboxylic acid having 6 to 16 C atoms. The PEBA also contains a subunit 2 made of at least one polyether diol having at least 3 C atoms per ether oxygen and primary OH groups at the chain ends. The sum of the C atoms of diamine and dicarboxylic acid is odd and is 19 or 21, and the number-average molar mass of the subunit 2 is 200 to 900 g/mol. A molded object can be created from the molding compound, which can be a molded part, a film, a bristle, a fiber, or a foam.