The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2025
Filed:
May. 01, 2020
Dic Corporation, Tokyo, JP;
Chikara Yoshioka, Takaishi, JP;
Kazutoshi Hitomi, Takaishi, JP;
DIC Corporation, Tokyo, JP;
Abstract
Provided is a fiber-reinforced molding material containing a thickening substance (A) containing a vinyl ester resin (a1), an unsaturated monomer (a2), a polyisocyanate (a3), and a polymerization initiator (a4) as essential raw materials and carbon fibers (B) with a fiber length of 2.5 mm to 50 mm. The thickening substance (A) satisfies conditions (1) to (3) below as measured with a rheometer. (1) The maximum value of the rate of change in viscosity in a temperature region lower than a temperature Xa indicating the lowest melt viscosity A is 100 Pa·s/° C. to 1,500 Pa·s/° C. (2) The maximum value of the rate of change in viscosity in a temperature region higher than or equal to the temperature Xa is 1,000 Pa·s/° C. to 10,000 Pa·s/° C. (3) The lowest melt viscosity A is 10 Pa·s to 1,000 Pa·s and the temperature Xa is 70° C. to 140° C.