The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Sep. 28, 2021
Applicant:

Axalta Coating Systems Ip Co., Llc, Wilmington, DE (US);

Inventors:

John R. Moore, Lansdale, PA (US);

Shih-Wa Wang, Glen Mills, PA (US);

Assignee:

AXALTA COATING SYSTEMS IP CO., LLC, Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1433 (2013.01); B41J 2/1623 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); B41J 2/1631 (2013.01); B41J 2/1637 (2013.01); B41J 2202/03 (2013.01);
Abstract

A nozzle plate defines at least one nozzle connected to the nozzle plate at a base, wherein the at least one nozzle has a height and a top having an inner width and an outer width, wherein a ratio of the height to the inner width is greater than 5, and wherein the nozzle plate comprises a borosilicate glass. The nozzle plate is formed via a method including providing a silicon wafer having a surface; providing a borosilicate glass wafer having a surface; etching the surface of the silicon wafer to form a plurality of trenches in the surface; anodically bonding the etched surface of the silicon wafer to the surface of the borosilicate glass wafer to form a two layer composite; heating the two layer composite at a temperature of at least about 750° C.; and releasing the silicon wafer from the borosilicate glass to form the nozzle plate.


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