The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Jan. 18, 2023
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Motoki Takabe, Shiojiri, JP;

Yu Shiozawa, Shiojiri, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1433 (2013.01); B41J 2/162 (2013.01); B41J 2/1629 (2013.01); B41J 2002/14467 (2013.01); B41J 2002/14475 (2013.01);
Abstract

A bonding substrate is provided with nozzle communication channels that establish communication between pressure chambers and nozzles. Each nozzle communication channel includes a pair of first inner wall surfaces constituting wall surfaces in a first direction, and a pair of second inner wall surfaces constituting wall surfaces in a second direction being orthogonal to the first direction. At least one of the second inner wall surfaces includes an inclined surface being inclined such that a length of the nozzle communication channel becomes gradually shorter toward the nozzle. An angle of the inclined surface relative to a liquid ejecting surface where the nozzles are opened is smaller than an angle of the first inner wall surface relative to the liquid ejecting surface.


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