The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Jun. 14, 2021
Applicant:

Toyobo Co., Ltd., Osaka, JP;

Inventors:

Mahiro Nakano, Inuyama, JP;

Toru Imai, Inuyama, JP;

Assignee:

TOYOBO CO., LTD., Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/32 (2006.01); B32B 7/022 (2019.01); B32B 7/023 (2019.01); B32B 7/03 (2019.01); B32B 27/08 (2006.01); C08J 5/18 (2006.01);
U.S. Cl.
CPC ...
B32B 27/32 (2013.01); B32B 7/022 (2019.01); B32B 7/023 (2019.01); B32B 7/03 (2019.01); B32B 27/08 (2013.01); C08J 5/18 (2013.01); B32B 2250/03 (2013.01); B32B 2250/242 (2013.01); B32B 2307/518 (2013.01); B32B 2307/536 (2013.01); B32B 2307/538 (2013.01); B32B 2310/022 (2013.01); B32B 2323/10 (2013.01); C08J 2323/12 (2013.01);
Abstract

The invention provides a biaxially-oriented polypropylene film that contains a base layer (A) comprising a polypropylene resin as a main component, a surface layer (B) provided at one side of the base layer (A), and a surface layer (C) provided at one side of the base layer (A) opposite to the surface layer (B), wherein the surface layer (B) has a wetting tension of 38 mN or more, a surface resistance value of 14.0 Log Ω or more, an arithmetic average roughness (Ra) of 3.0-5.5 nm, a Martens hardness of 248 N/mmor less, and a center plane average surface roughness (SRa) of 0.010-0.026 μm, and the surface layer (C) has a center plane average surface roughness (SRa) of 0.020 μm or more and a Martens hardness of 270 N/mmor more.


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