The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Dec. 15, 2022
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Yoshimasa Nishi, Nagaokakyo, JP;

Tomohiro Nagai, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 7/022 (2019.01); B32B 15/20 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
B32B 15/08 (2013.01); B32B 7/022 (2019.01); B32B 15/20 (2013.01); H05K 1/0218 (2013.01); H05K 1/0237 (2013.01); H05K 1/032 (2013.01); H05K 3/4655 (2013.01); B32B 2305/55 (2013.01); B32B 2307/538 (2013.01); B32B 2457/08 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0355 (2013.01);
Abstract

A multilayer resin substrate includes resin layers that are laminated, a first copper foil on the resin layers and including first and second main surfaces having first and second surface roughnesses, respectively, and a second copper foil on the resin layers and including third and fourth main surfaces having third and fourth surface roughnesses, respectively. A distance between the first main surface and the second copper foil is shorter than a distance between the second main surface and the second copper foil. When the first, second, third, and fourth surface roughnesses are denoted as SR, SR, SR, and SRrespectively, a relationship SR<SR≤SR<SRis satisfied.


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