The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2025
Filed:
Jan. 19, 2021
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Kakeru Sasagawa, Matsumoto, JP;
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/80 (2006.01); B29C 45/77 (2006.01); B29C 45/78 (2006.01);
U.S. Cl.
CPC ...
B29C 45/80 (2013.01); B29C 45/77 (2013.01); B29C 45/78 (2013.01); B29C 2945/76006 (2013.01); B29C 2945/7604 (2013.01); B29C 2945/76083 (2013.01); B29C 2945/7618 (2013.01); B29C 2945/76257 (2013.01); B29C 2945/76381 (2013.01); B29C 2945/76498 (2013.01); B29C 2945/76568 (2013.01); B29C 2945/76949 (2013.01);
Abstract
An inspection method for an injection molding device includes: a first step of acquiring a first detection value from a sensor using a test mold having the sensor, the sensor measuring a temperature or pressure of a molten material injected from a first injection molding device into a cavity section demarcated by a fixed mold and a moving mold; a second step of injecting a molten material from a second injection molding device into the cavity section and acquiring a second detection value from the sensor; and a third step of performing an inspection using the first detection value and the second detection value.