The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Jan. 25, 2022
Applicant:

Hamamatsu Photonics K.k., Hamamatsu, JP;

Inventors:

Takafumi Ogiwara, Hamamatsu, JP;

Hayate Joan, Hamamatsu, JP;

Assignee:

HAMAMATSU PHOTONICS K.K., Hamamatsu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/53 (2014.01); B23K 26/073 (2006.01); G01N 21/95 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B23K 26/53 (2015.10); B23K 26/073 (2013.01); G01N 21/9501 (2013.01); H01L 21/67092 (2013.01);
Abstract

A laser processing device includes: a laser irradiation unit; and a control unit. The control unit is configured to execute a first control to control the laser irradiation unit to form modified regions for division along each of lines extending in an X direction and cracks extending from the modified regions in a direction of a surface, a second control to control the laser irradiation unit to form modified regions for division along each of a plurality of lines in a Y direction and cracks extending from the modified regions in the direction of the surface, and a third control to control the laser irradiation unit to form cracks extending from a plurality of modified regions for suppressing warpage before the second control, the cracks being formed to reach a back surface and not to be continuous with the cracks extending from the modified regions for division.


Find Patent Forward Citations

Loading…