The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Sep. 09, 2021
Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Chun-Lien Huang, Taoyuan, TW;

Wen-Yu Chuang, Taoyuan, TW;

Keng-Ning Chang, Taoyuan, TW;

Ting-Yu Lu, Taoyuan, TW;

Chun-Fei Kung, Taoyuan, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/06 (2014.01); B23K 1/005 (2006.01); B23K 26/03 (2006.01); B23K 26/60 (2014.01); G05B 19/418 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0665 (2013.01); B23K 1/0056 (2013.01); B23K 26/034 (2013.01); B23K 26/0648 (2013.01); B23K 26/60 (2015.10); G05B 19/41875 (2013.01); B23K 2101/42 (2018.08); G05B 2219/45026 (2013.01); G05B 2219/45235 (2013.01);
Abstract

A laser soldering system using dynamic light spot and a method thereof are provided. A laser module is controlled to radiate toward multi-lens to form a light spot on a soldering target for soldering, and a lens distance between the multi-lens is adjusted to adjust a light spot size. The disclosure may provide multiple heating densities respectively adequate to different soldering status via adjusting the light spot size when using same laser power, so as to improve the soldering quality.


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Huang, Chun-Lien. (2025). Laser soldering system using dynamic light spot and method thereof (U.S. Patent No. 12269118). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12269118

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