The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Apr. 12, 2024
Applicant:

Mgi Holdings Co., Limited, Shenzhen, CN;

Inventors:

Yan-You Lin, Fremont, CA (US);

Jian Gong, Danville, CA (US);

Frank Zhong, Menlo Park, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); A47L 15/42 (2006.01); A61L 27/16 (2006.01); A61L 27/56 (2006.01); B01F 23/00 (2022.01); B01F 23/41 (2022.01); B01F 101/23 (2022.01); B01L 7/00 (2006.01); B01L 9/00 (2006.01); B23Q 17/24 (2006.01); C07K 14/705 (2006.01); C08F 220/56 (2006.01); C08L 33/26 (2006.01); C12M 1/34 (2006.01); C12Q 1/04 (2006.01); C12Q 1/18 (2006.01); C12Q 1/6844 (2018.01); C12Q 1/6851 (2018.01); C12Q 1/686 (2018.01); G01K 1/02 (2021.01); G01N 1/31 (2006.01); G01N 21/17 (2006.01); G01N 21/3577 (2014.01); G01N 21/359 (2014.01); G01N 21/39 (2006.01); G01N 21/45 (2006.01); G01N 21/64 (2006.01); G01N 21/77 (2006.01); G01N 21/78 (2006.01); G01N 27/414 (2006.01); G01N 30/12 (2006.01); G01N 30/68 (2006.01); G01N 30/70 (2006.01); G01N 30/72 (2006.01); G01N 30/88 (2006.01); G01N 33/00 (2006.01); G01N 33/18 (2006.01); G01N 33/50 (2006.01); G01N 33/53 (2006.01); G01N 33/543 (2006.01); G01N 33/68 (2006.01); G01N 33/74 (2006.01); G01N 35/00 (2006.01); G01N 35/04 (2006.01); G01N 35/10 (2006.01); G06T 7/00 (2017.01); G06T 7/90 (2017.01); G16H 20/60 (2018.01); G16H 40/63 (2018.01); H10K 10/46 (2023.01); H10K 85/00 (2023.01); H10K 85/20 (2023.01);
U.S. Cl.
CPC ...
B01L 3/502792 (2013.01); B01L 7/52 (2013.01); C12Q 1/6851 (2013.01); G01K 1/026 (2013.01); B01L 2200/10 (2013.01); B01L 2200/147 (2013.01); B01L 2300/0645 (2013.01); B01L 2300/1827 (2013.01); B01L 2400/0427 (2013.01); C01B 2203/1614 (2013.01); G01K 2217/00 (2013.01);
Abstract

A microfluidic device includes first and second substrate structures. The first substrate structure has a first substrate surface configured to receive one or more droplets. A plurality of electrodes configured to apply an electric field to the droplets. The second substrate structure has a second substrate surface facing the first substrate surface and spaced apart from the first substrate surface to form a fluid channel. The microfluidic device has a first heating element adjacent to the first substrate structure and disposed on an opposite side of the first substrate surface, and a second heating element adjacent to the second substrate structure and disposed on an opposite side of the second substrate surface. The microfluidic device further includes one or more temperature sensors disposed adjacent to the fluid channel between the first substrate structure and the second substrate structure.


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