The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

H10K 50/844 (2023.01); H10K 50/84 (2023.01); H10K 50/842 (2023.01); H10K 59/12 (2023.01); H10K 59/124 (2023.01); H10K 59/131 (2023.01); H10K 59/38 (2023.01); H10K 50/86 (2023.01); H10K 77/10 (2023.01); H10K 102/00 (2023.01);

U.S. Cl.

CPC ...

H10K 50/8445 (2023.02); H10K 50/84 (2023.02); H10K 50/8426 (2023.02); H10K 50/844 (2023.02); H10K 59/12 (2023.02); H10K 59/124 (2023.02); H10K 59/131 (2023.02); H10K 59/38 (2023.02); H10K 50/865 (2023.02); H10K 77/111 (2023.02); H10K 2102/311 (2023.02); H10K 2102/351 (2023.02);

Abstract

A highly reliable light-emitting device is provided. Damage to an element due to externally applied physical power is suppressed. Alternatively, in a process of pressure-bonding of an FPC, damage to a resin and a wiring which are in contact with a flexible substrate due to heat is suppressed. A neutral plane at which stress-strain is not generated when a flexible light-emitting device including an organic EL element is deformed, is positioned in the vicinity of a transistor and the organic EL element. Alternatively, the hardness of the outermost surface of a light-emitting device is high. Alternatively, a substrate having a coefficient of thermal expansion of 10 ppm/K or lower is used as a substrate that overlaps with a terminal portion connected to an FPC.

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