The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

Jun. 01, 2023
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Leonard Charles Dabich, II, Painted Post, NY (US);

Stephan Lvovich Logunov, Corning, NY (US);

Mark Alejandro Quesada, Horseheads, NY (US);

Alexander Mikhailovich Streltsov, Corning, NY (US);

Assignee:

CORNING INCORPORATED, Corning, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10K 50/842 (2023.01); B23K 26/20 (2014.01); B32B 7/04 (2019.01); B32B 17/06 (2006.01); B32B 37/06 (2006.01); C03B 23/203 (2006.01); C03C 3/12 (2006.01); C03C 3/14 (2006.01); C03C 3/16 (2006.01); C03C 3/23 (2006.01); C03C 3/247 (2006.01); C03C 4/00 (2006.01); C03C 8/24 (2006.01); C03C 23/00 (2006.01); C03C 27/06 (2006.01); C03C 27/08 (2006.01); H10K 71/50 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 50/8426 (2023.02); B23K 26/206 (2013.01); B32B 7/04 (2013.01); B32B 17/06 (2013.01); B32B 37/06 (2013.01); C03B 23/203 (2013.01); C03C 3/12 (2013.01); C03C 3/14 (2013.01); C03C 3/16 (2013.01); C03C 3/23 (2013.01); C03C 3/247 (2013.01); C03C 4/0071 (2013.01); C03C 8/24 (2013.01); C03C 23/0025 (2013.01); C03C 27/06 (2013.01); C03C 27/08 (2013.01); H10K 71/50 (2023.02); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2255/20 (2013.01); B32B 2310/0825 (2013.01); B32B 2310/0831 (2013.01); B32B 2310/0843 (2013.01); B32B 2457/206 (2013.01); C03C 2204/00 (2013.01); C03C 2207/00 (2013.01); C03C 2218/32 (2013.01); H10K 2102/00 (2023.02);
Abstract

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.


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