The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2025
Filed:
Mar. 16, 2023
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Toru Komatsu, Nagaokakyo, JP;
Tadashi Nomura, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto-fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/305 (2013.01); H05K 1/181 (2013.01); H05K 3/0052 (2013.01); H05K 3/3478 (2013.01); H05K 2201/10007 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/0264 (2013.01);
Abstract
An electronic component module includes a plurality of components having terminals and arranged along a plane, a sealing resin portion that covers and seals these components and has a plane as one plane of an outer surface, and a shield layer that covers the outer surface of the sealing resin portion. Terminals of the plurality of components are exposed in a state of protruding from the plane of the sealing resin portion, and the terminals of these components protruding from the plane of the sealing resin portion are used as mounting terminals of the electronic component module.