The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

Sep. 29, 2022
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Noboru Serita, Nagaokakyo, JP;

Yoshiyuki Abe, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H01G 4/008 (2006.01); H01G 4/30 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01G 4/0085 (2013.01); H01G 4/30 (2013.01); H05K 1/181 (2013.01); H05K 2201/09418 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/2081 (2013.01);
Abstract

A mounting structure of an electronic component includes a multilayer ceramic capacitor including lands on a board and spaced apart from each other, solder on the lands, and a component main body including external electrodes on both end portions of the component main body in a length direction, each of the pair of external electrodes being connected to a corresponding one of the pair of lands via the solder. When a separation direction of the lands is an X direction and a direction orthogonal or substantially orthogonal to the X direction is a Y direction, when a width dimension of the land along the Y direction is c, a dimension of each of the external electrodes in the X direction is e, and a gap between the land and the external electrode is Gap, 3.4<(c×e)/Gap<258.8 is satisfied.


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